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| The R & D group at a maker of metrology devices for wafer processing equipment, CyberOptics Semiconductor, Inc., has developed a new wireless sensor that allows fab engineers to monitor airborne particles in process equipment to validate and analyze wafer contamination in real-time to reduce wafer scrap and improve die yield with a wafer-like device -- the WaferSense Airborne Particle Sensor (APS). | |
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